Mechanical test

  • Sine vibration
  • Random vibration
  • Combined vibration / Temperature cycling
  • Half sine bump and shock
  • Board level bending and shock
  • IP classification
  • Dimensions and mass measurements
  • Wire and solderball pull / shear test

A wide range of mechanical stress applications or measurements can be executed by MASER Engineering. The mechanical properties of an electronic system enclosure have to be stressed in order to determine the robustness of the total system. The multiple electrical interconnections have our special attention.

Dedicated equipment is available for lead-free solder interconnect reliability. Monitored mechanical shock test on daisy chain parts are a good representation of the behavior of handheld equipment drop. This dedicated setup is used by Tier 1 mobile phone suppliers.

MASER Engineering has developed a dedicated bending system for endurance stress test of BGA and CSP package interconnections. This monitored system can apply high amounts of board level bending movements automatically, until one interconnection fails. The classic vibration and shock test is used to test the robustness of a complete system.