Failure Analysis

  • Non-destructive testing
  • Electrical parameter / structural analysis
  • Mechanical probing
  • Laser assisted fault localization / OBIRCH
  • FIB/SEM dual beam preparation / imaging
  • CCD / InGaAs Photon Emission Microscopy

Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.

MASER Engineering is offering a wide range of preparation tools, electrical and physical fault localization systems, optical, electron and ion microscopy to analyze the failing component. The results of this process are exchanged over our secure web link between our customer and our F/A engineers.